Główna > CERN Experiments > LHC Experiments > ATLAS > ATLAS Preprints > Qualification of the first preproduction 3D FBK sensors with ITkPixV1\ |
ATLAS Slides | |
Report number | ATL-ITK-SLIDE-2022-668 |
Title | Qualification of the first preproduction 3D FBK sensors with ITkPixV1\ |
Author(s) |
Ressegotti, Martina (INFN e Universita Genova (IT)) ; Calderini, Giovanni (Centre National de la Recherche Scientifique (FR)) ; Crescioli, Francesco (Centre National de la Recherche Scientifique (FR)) ; Dalla Betta, Gian Franco (Universita degli Studi di Trento and INFN (IT)) ; Gariano, Giuseppe (INFN e Universita Genova (IT)) ; Gemme, Claudia (INFN e Universita Genova (IT)) ; Guescini, Francesco (Max Planck Society (DE)) ; Hadzic, Sejla (Max Planck Society (DE)) ; Heim, Timon (Lawrence Berkeley National Lab. (US)) ; Lapertosa, Alessandro (INFN e Universita Genova (IT)) ; Ravera, Simone (INFN e Universita Genova (IT)) ; Rummler, Andre (CERN) ; Samy, Md Arif Abdulla (Universita degli Studi di Trento and INFN (IT)) ; Sultan, D M S (Universita degli Studi di Trento and INFN (IT)) ; Vannoli, Leonardo (INFN e Universita Genova (IT)) |
Corporate author(s) | The ATLAS collaboration |
Submitted to | 10th International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.ATL-ITK-SLIDE-2022-668 |
Submitted by | [email protected] on 09 Jan 2023 |
Subject category | Particle Physics - Experiment |
Accelerator/Facility, Experiment | CERN LHC ; ATLAS |
Free keywords | FUTURE |
Abstract | The ITk detector, the new ATLAS silicon tracking system for High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be 25x100 μm² in the barrel and 50x50 μm² in the end-caps, with one read-out electrode at the centre of each pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 μm²) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beams. Few of these modules have been irradiated in Bonn and at the CERN IRRAD facility. Preliminary results of their characterization after irradiation will be shown, including measurements performed during SPS test beam campaigns in Summer 2022. |