CERN Accelerating science

ATLAS Slides
Report number	ATL-INDET-SLIDE-2014-565
Title	Performance tests during the IBL Stave Integration
Author(s)	Jentzsch, J (CERN/TU Dortmund)
Corporate author(s)	The ATLAS collaboration
Submitted to	7th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Niagara Falls, Ontario, Canada, 1 - 5 Sep 2014
Submitted by	[email protected] on 29 Aug 2014
Subject category	Particle Physics - Experiment
Accelerator/Facility, Experiment	CERN LHC ; ATLAS
Free keywords	LHC ; ATLAS IBL
Abstract	In preparation of the ATLAS Pixel Insertable B-Layer integration, two detector components, so called staves, were mounted around the Beryllium ATLAS beam pipe and tested using production quality assurance measurements as well as dedicated data taking runs to validate a correct grounding and shielding schema. Each stave consists of 32 FE-I4 readout chips of ~ 2x2cm size which sums up to over 860k pixels per stave. The integration tests include verification that neither the silicon n-in-n nor the silicon 3D sensors were damaged by mechanical stress, and that their readout chips, including their bump bond and wire bond connections, did not suffered from the integration process. Evolution of the IBL performance during its integration will be discussed as well as its final performance before installation.