| Article | |
| Title | Wafer test of the LHCb Outer Tracker TDC-Chip |
| Author(s) | Knopf, Jan ; Muckerheide, R ; Stange, U ; Trunk, U ; Uwer, U ; Wiedner, D |
| Affiliation | (Physikalisches Institut der Universität Heidelberg, Heidelberg, Germany) |
| Publication | CERN, 2007 |
| Number of pages | 4 |
| In: | Proceedings of the Twelfth Workshop on Electronics for LHC and Future Experiments, pp.475-478 |
| DOI | 10.5170/CERN-2007-001.475 |
| Subject category | Detectors and Experimental Techniques |
| Accelerator/Facility, Experiment | CERN LHC ; LHCb |
| Abstract | The OTIS-TDC is the front end readout chip for the LHCb Outer Tracker. It is designed to measure drift times with a resolution better than 1 ns. As the chip will be directly mounted to its board, the test have to be performed on the wafer itself. As the testing period for 7 000 chips was only three weeks, many test routines have been implemented on a FPGA. Each chip is subjected to detailed probe testing to ensure the full functionality as well as a good performance. Overall 47 wafer have been tested. From the chips passing the test 2 000 have been used in the Outer Tracker front end electronic. |
Datensatz erzeugt am 2007-05-16, letzte Änderung am 2016-11-22
