CERN Accelerating science

Article
Title Development of a large-area, light-weight module using the MALTA monolithic pixel detector
Author(s) Dachs, F (CERN) ; Allport, P (Birmingham U.) ; Asensi Tortajada, I (CERN) ; Berlea, D V (DESY) ; Bortoletto, D (Oxford U.) ; Buttar, C (Glasgow U.) ; Charbon, E (Ecole Polytechnique, Lausanne) ; Dao, V (CERN) ; Denizli, H (Abant Izzet Baysal U.) ; Dobrijevic, D (CERN ; Zagreb U.) ; Flores Sanz de Acedo, L (CERN ; Glasgow U.) ; Gabrielli, A (CERN) ; Gonella, L (Birmingham U.) ; Gonzalez, V (Valencia U., IFIC) ; Gustavino, G (CERN) ; LeBlanc, M (CERN) ; Oyulmaz, K Y (Abant Izzet Baysal U.) ; Pernegger, H (CERN) ; Piro, F (CERN ; Ecole Polytechnique, Lausanne) ; Riedler, P (CERN) ; van Rijnbach, M (CERN ; Oslo U.) ; Sandakerj, H ; Sharma, A (CERN) ; Snoeys, W (CERN) ; Solans Sanchez, C A (CERN) ; Suligoj, T (Zagreb U.) ; Vásquez, M (Valencia U., IFIC) ; Pinto, M Vicente Barreto (Geneva U.) ; Weick, J (CERN ; Darmstadt, Tech. Hochsch.) ; Worm, S (DESY) ; Zoubirl, A M
Publication 2023
Number of pages 3
In: Nucl. Instrum. Methods Phys. Res., A 1047 (2023) 167809
In: 15th Pisa Meeting on Advanced Detectors, La Biodola - Isola D'elba, Italy, 22 - 28 May 2022, pp.167809
DOI 10.1016/j.nima.2022.167809 (publication)
Subject category Detectors and Experimental Techniques
Project CERN-EP-RDET
Abstract The MALTA pixel chip is a 2 cm × 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow chip-to-chip data transfer. The power pads are located mainly at the side edges on the chip which allows for chip-to-chip power transmission. The MALTA chip has been used to study module assembly using different interconnection techniques to transmit data and power from chip to chip and to minimize the overall material budget. Several 2-chip and 4-chip modules have been assembled using standard wire bonding, ACF (Anisotropic Conductive Films) and laser reflow interconnection techniques. These proceedings will summarize the experience with the different interconnection techniques and performance tests of MALTA modules with 2 and 4 chips tested in a cosmic muon telescope. They will also show first results on the effect of serial power tests on chip performance as well as the impact of the different interconnection techniques and the results of mechanical tests. Finally, a conceptual study for a flex based ultra-light weight monolithic pixel module based on the MALTA chip with minimum interconnections is presented.
Copyright/License publication: © 2022-2025 The Author(s) (License: CC-BY-4.0)

Corresponding record in: Inspire


 ჩანაწერი შექმნილია 2023-01-17, ბოლოს შესწორებულია 2024-07-05


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