Title
| A Compact, Low-Field, Broadband Matching Section for Externally-Powered X-Band Dielectric-Loaded Accelerating Structures |
Related title | A COMPACT, LOW-FIELD, BROADBAND MATCHING SECTION FOR EXTERNALLY-POWERED X-BAND DIELECTRIC-LOADED ACCELERATING STRUCTURES
|
Author(s)
| Wei, Yelong (CERN ; Liverpool U. ; Cockcroft Inst. Accel. Sci. Tech.) ; Bursali, Hikmet (Rome U.) ; Catalán Lasheras, Nuria (CERN) ; Freemire, Ben (Euclid Techlabs, Solon) ; González Antón, Sergio (CERN) ; Grudiev, Alexej (CERN) ; Jing, Chunguang (Euclid Techlabs, Solon) ; Sauza-Bedolla, Joel (Lancaster U.) ; Wegner, Rolf (CERN) ; Welsch, Carsten P (Liverpool U. ; Cockcroft Inst. Accel. Sci. Tech.) |
Publication
| Geneva : JACoW, 2021 |
Number of pages
| 4 |
In:
| JACoW IPAC 2021 (2021) 495-498 |
In:
| 12th International Particle Accelerator Conference (IPAC 2021), Online, 24 - 28 May 2021, pp.495-498 |
DOI
| 10.18429/JACoW-IPAC2021-MOPAB142 (publication)
|
Subject category
| Accelerators and Storage Rings |
Abstract
| It has been technically challenging to efficiently couple external radiofrequency (RF) power to cylindrical dielectric-loaded accelerating (DLA) structures. This is especially true when the DLA structure has a high dielectric constant. This contribution presents a novel design of a matching section for coupling the RF power from a circular waveguide to an X-band DLA structure with a dielectric constant ε_{r}=16.66 and a loss tangent \tanθ = 3.43× 10⁻⁵. It consists of a very compact dielectric disk with a width of 2.035 mm and a tilt angle of 60 degrees, resulting in a broadband coupling at a low RF field which has the potential to survive in the high-power environment. To prevent a sharp dielectric corner break, a 45-degree chamfer is added. Moreover, a microscale vacuum gap, caused by metallic clamping between the thin coating and the outer thick copper jacket, is studied in detail. Based on simulation studies, a prototype of the DLA structure with the matching sections was fabricated. Results from preliminary bench measurements and their comparison with design values will also be discussed. |
Copyright/License
| publication: ® 2021 (License: CC-BY-3.0) |