Newsgroups: comp.robotics
Path: brunix!cat.cis.Brown.EDU!agate!howland.reston.ans.net!newsserver.jvnc.net!jvnc.net!tigger.jvnc.net!sestrich
From: sestrich@dovetail.timeplex.com (Joe Sestrich)
Subject: Re: Removing tops of ICs
In-Reply-To: Jurgen Van Gorp's message of 5 Aug 1994 06:54:38 GMT
Message-ID: <SESTRICH.94Aug5084345@dovetail.timeplex.com>
Sender: news@tigger.jvnc.net (Zee News Genie)
Nntp-Posting-Host: dovetail.timeplex.com
Organization: Ascom Timeplex, Acton, MA
References: <31pprv$l1a@nnrp.ucs.ubc.ca> <31r999$m2p@oak.oakland.edu>
	<31snne$nkr@rc1.vub.ac.be>
Date: Fri, 5 Aug 1994 12:43:45 GMT
Lines: 13


	"Royal water" is the name given to a mixture of concentrated
	hydroflouric and nitric acids, so called because it is the only
	material that will disolve gold.  As such I would assume that using
	it on an IC would put the bond wires at risk.... 

	Hydroflouric acid is very nasty stuff; the flourine is quickly absorbed
	right through the skin, even before the acid disolves it.  Nitric
	acid has dangerous fumes (corrosives in the lungs are not fun), and will
	eat up your skin, but is not otherwise poisonous at such low doses as HF.
--

	Joe Sestrich				ASCOM Timeplex
