CERN Accelerating science

ATLAS Note
Report number ATL-ITK-PROC-2022-013
Title Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
Author(s)

Lapertosa, Alessandro (INFN e Universita Genova (IT)) ; Gariano, Giuseppe (INFN e Universita Genova (IT)) ; Gemme, Claudia (INFN e Universita Genova (IT)) ; Ravera, Simone (INFN e Universita Genova (IT)) ; Vannoli, Leonardo (INFN e Universita Genova (IT)) ; Dalla Betta, Gian Franco (Universita degli Studi di Trento and INFN (IT)) ; Samy, Md Arif Abdulla (Universita degli Studi di Trento and INFN (IT)) ; D M S, Sultan ; Rummler, Andre (CERN) ; Guescini, Francesco (Max Planck Society (DE)) ; Crescioli, Francesco (Centre National de la Recherche Scientifique (FR)) ; Heim, Timon (Lawrence Berkeley National Lab. (US)) ; Hadzic, Sejla (Max Planck Society (DE)) ; Ye, Hua (Georg August Universitaet Goettingen (DE))

Corporate Author(s) The ATLAS collaboration
Publication 2022
Imprint 26 Sep 2022
Number of pages 10
In: JINST 18 (2023) C01010
In: 23rd International Workshop for Radiation Imaging Detectors, Riva Del Garda, It, 26 - 30 Jun 2022, pp.C01010
DOI 10.1088/1748-0221/18/01/C01010
Subject category Particle Physics - Experiment
Accelerator/Facility, Experiment CERN LHC ; ATLAS
Abstract ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 µm2) produced by FBK have been bump bonded to ITkPixv1.1 chip at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beam.

Corresponding record in: INSPIRE


 Záznam vytvorený 2022-09-26, zmenený 2023-10-09