CERN Accelerating science

ATLAS Note
Report number	ATL-ITK-PROC-2021-007
Title	RD53B Wafer Testing for the ATLAS ITk Pixel Detector
Author(s)	Standke, Mark (University of Bonn (DE))
Corporate Author(s)	The ATLAS collaboration
Collaboration	ATLAS Collaboration
Publication	2022
Imprint	07 Jul 2021
Number of pages	4
In:	J. Phys.: Conf. Ser. 2374 (2022) 012087
In:	International Conference on Technology and Instrumentation in Particle Physics (TIPP 2021), Online, Canada, 24 - 29 May 2021, pp.012087
DOI	10.1088/1742-6596/2374/1/012087
Subject category	Particle Physics - Experiment
Accelerator/Facility, Experiment	CERN LHC ; ATLAS
Free keywords	RD53 ; ITK ; ITKPIX ; BONN ; BDAQ53 ; BDAQ ; WAFER ; WAFERPROBING ; TESTING ; QA ; QC
Abstract	RD53 is the research and development group at CERN responsible for developing and producing the next generation of readout chips for the ATLAS and CMS pixel detectors at the HL-LHC. Its most recent development ITkPix/RD53B is the rst full-scale 65 nm hybrid pixel-readout chip. ITkPix consists of more than one billion transistors with high memory triplication ratio in order to cope with the high particle density at the heart of ATLAS. The chips will be located as close as possible to the interaction point to optimize impact parameter resolution. The ITkPix chip features a 5Gbit connection, with special data compression to deal with high hit intensities. In addition to that, a low power, low noise analog front-end is used, to ensure high readout speeds and low detection thresholds. A failure of chips at the heart of ATLAS is problematic. Therefore, thorough testing before and during production is necessary. For this purpose, Bonn has developed BDAQ53, a fast and versatile simulation and testing environment, allowing for small-and large-scale testing for ITkPix and its successor chips. This conference note will give an overview over the testing environment, while focusing on large-scale wafer testing to evaluate ITkPix's tness for its deployment at the HL-LHC.

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