| Hovedsiden > The metallurgical mechanisms of solder fatigue |
| Preprint | |
| Report number | LBL-28405 |
| Title | The metallurgical mechanisms of solder fatigue |
| Author(s) | Morris, J W ; Tribula, D ; Summers, T S E ; Grivas, D |
| Publication | 1989 |
| Imprint | Dec 1989 |
| Number of pages | 8 |
| Presented at | National Electronic Packaging and Production Conference - NEPCON West '90, Anaheim, CA, USA, 28 Feb 1990 |
| Subject category | Engineering |